Aluminum Nitride (AlN) Sputtering Target
  • Attributes Name
    Ceramic Sputtering Target
  • Product Name
    Aluminum Nitride sputtering target
  • Element Symbol
    AlN
  • Purity
    2N5
  • Shape
    Planar
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Description
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Xinkang can produce and supply full range of ceramic sputtering targets and compound targets, including oxide sputtering targets, carbide sputtering targets, fluoride sputtering targets, sulfide sputtering targets and so on. The production technology of ceramic sputtering targets are hot press. From the selection of raw materials to the control of temperature, pressure and time of hot press sintering, we strictly follow the specific production process, thus the finished ceramic sputtering targets have the characteristics of high purity, high density, uniform surface color without spots and crack, the end user can obtain constant erosion rates and high pure and homogeneous thin films during PVD process.

Aluminum Nitride Sputtering Target
Purity: 99.5%;
Production Method: hot press sintering
Available dimensions:
Circular: Diameter <= 14 inch, Thickness >= 3 mm;
Rectangular: Length <= 14 inch, Width <= 10 inch, Thickness >= 3 mm.
Type of Bond: Indium, Elastomer. 

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