Welcome to Changsha Xinkng Advanced MaterialsCo.,Ltd,a professional producer of sputtering targets
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Changsha Xinkng Advanced MaterialsCo.,Ltd Questions And Answers
常见问题
  • Which is the best way to contact us for inquiry?

    You can get in touch with us by email (sales@xk-sputteringtarget.com), phone (+86-73184027969), mobile (86-18670345476), our sales engineers are all on service at working time.


  • How long will you take to get a quotation from us?

    No matter if your desired product is available in our factory, we will reply you within 1 working days once we got your inquiry.


  • What is the best way to send a drawing to us?

    We can accept drawing by fax, or e-mail. We accept all cad formats. To speed your quotation, please ensure that the dimension and tolerance of drawings are properly and completely marked.


  • Do you have what I need in stock?

    We carry a large inventory for regular specifications, so it is possible that we have what you are looking for in our warehouse. If not, our lead times are significantly shorter than other suppliers.


  • What if you can't find desired products on our web site?

    Please contact our sales engineers to confirm if it's available


  • Are you factory or trading company?

    We are a small-scale manufacturing factory specialized in producing metal thin film materials, we are located on Changsha county, Hunan province, and you are welcomed to visit us at any time.


  • What is vacuum metalizing? Vacuum evaporation? Vacuum deposition?

    All of these terms can be used to describe the same process, with vacuum metalizing being a more specific case. Within the confines of a chamber which has had most of the air removed, metals or other materials are heated until they vaporize. This vapor travels about the chamber and condenses on surfaces within the chamber, forming a thin film.


  • Why is the deposition performed under vacuum?

    Two reasons - to lower the boiling point of the material to be deposited and to allow the subsequent vapor to travel about the chamber without interference from air molecules.


  • What is sputtering target?


    A sputtering target is a material that is used to create thin films in a technique known as sputter deposition, or thin film deposition. During this process the sputtering target material, which begins as a solid, is broken up by gaseous ions into tiny particles that form a spray and coat another material, which is known as the substrate. Sputter deposition is commonly involved in the creation of semiconductors and computer chips. As a result, most sputtering target materials are metallic elements or alloys, although there are some ceramic targets available that create hardened thin coatings for various tools.


  • What is target poisoning?

    Magnetron sputtering is one of the most frequently applied tools for the deposition of high quality functional coatings. For high-rate deposition, sputtering of compound films is often performed in the "reactive" mode, where a metal target is exposed to a discharge in a rare gas with some fraction of reactive gas (such as oxygen or nitrogen) added. The performance of reactive sputtering is, however, impeded by the effect of target "poisoning", which means that a compound film is not only formed on the substrate as desired, but also on the sputter target, which results in a significantly reduced sputter yield and, thereby, reduced deposition rate. A further consequence of poisoning is a hysteresis of the reactive gas partial pressure at increasing/decreasing reactive gas flow, and, associated to this, an unstable operation regime between high and low target uptake at constant partial flow of the reactive gas, which often requires additional means of stabilization in practical applications.


  • How to choose backingplate for your targets?

    the Functions Of A Backing Plate Are:

    •    supporting the target esp. the weak target materials during sputtering such as ceramic and soft metallic materials
    •    provide heat extraction(cooling) from Sputtering process
    •    Sealing from magnetron cooling system and vacuum chamber 
       

    Selection Of Backing Plate Materials Where The Following Factors Must Be Considered: 

    •    Thermal Expansion of the Backing plate materials and Sputtering target. 
    •    Electrical Conductivity 
    •    Mechanical Properties to withstand the cooling water pressure and thermal cycling effect.
    •    Reusable
       

    Backing Plate Materials Available In Our Plant  Are: 

       Oxygen Free Copper (Cu Backing Plate)

     The most commonly backing materials is is Oxygen Free Copper (OFHC) .This is readily available metal has good thermal conductivity and electrical conductivity, while also being easy to machine. Copper backing plates can be re-used, with care, twenty times or more.

        Molybdenum Backing Plate (Mo Backing Plate)

    Molybdenum Backing Plate is suitable for high temperature bond , while copper may also oxidize badly or warp, and also matching with target materials where copper coefficient of expansion is mismatched, such as ceramics.

        Aluminium Backing Plate (Al Backing Plate)

     Similarly for high thermal conductivity and matching to the target materials coefficient of expansion as well as suitable for diffusion bonding.

       Stainless Steel

    Commonly used for Rotatable sputtering target where it provide a low cost recyclable backing tube. 

    Moreover, copper zinc (CuZn) alloy and copper chromium (CuCr) alloy backing plate are also available in our plant, if you are interested, pleasecontact our sales engineeers for more information.