Five important factors affecting the deposition rate of magnetron sputtering target coatings:working pressure,sputtering voltage,target base spacing,sputtering current and sputtering power.

As we all know, lanthanum boride is a thermionic material with the ability to emit electrons. Lanthanum boride sputtering targets have been used in the coating of electronic components.

The strength, hardness, weldability and corrosion resistance of the aluminum-scandium alloy sputtering target make it widely used in aerospace, sports equipment, electronic products and other fields.

One of the common methods of physical vapor deposition (PVD) is thermal evaporation. This is a form of thin film deposition. It is a vacuum technology used to apply evaporation coating materials to the surface of various objects.

Electron beam evaporation is a type of physical vapor deposition (PVD) technique, which directly heats the evaporation material (usually pellets) by using an electron beam under vacuum, and transports the vaporized material to the substrate to form a film.

The main factors that affect the sputtering voltage of a magnetron target are: the magnetic field of the target surface, the target material, the gas pressure, the cathode-anode distance, and so on.

Common target shapes are plane targets and rotating targets. Cylindrical plane sputtering targets. It is a new type of sputtering target with a very broad application market.

Common sputtering targets on the market mainly include plane targets and rotating targets, each of which has its own advantages and disadvantages.For planar targets, the main advantages are simple structure, strong versatility, and good film uniformity and repeatability.

The full name of ITO is indium tin oxide, a composition of indium, tin, and oxygen with different proportions.

There are four main forming methods for ITO target materials, and today I think it is necessary to talk about the advantages and disadvantages of each method, which will help you to choose between them when preparing ITO target materials

The four main forming methods of ITO target materials are: spraying method, cold isostatic pressing method, hot isostatic pressing method, and wet forming.

The maintenance methods of the sputtering target include the cleaning of the target, the sealing check, and the maintenance of the sputtering target

In the sputtering process of the coating of the target material, the quality of the target material is higher than that of the traditional material industry.

The titanium sputtering target is more like a titanium product. Using titanium as a raw material, titanium sputtering targets can be made by various methods.

Metal titanium and titanium sputtering targets are basically the same, and both are composed of titanium. Titanium targets are mainly used to coat surface panel displays of integrated circuits, flat panels and other components, or as decoration and glass coating.