One of the common methods of physical vapor deposition (PVD) is thermal evaporation. This is a form of thin film deposition. It is a vacuum technology used to apply evaporation coating materials to the surface of various objects.

Electron beam evaporation is a type of physical vapor deposition (PVD) technique, which directly heats the evaporation material (usually pellets) by using an electron beam under vacuum, and transports the vaporized material to the substrate to form a film.

The main factors that affect the sputtering voltage of a magnetron target are: the magnetic field of the target surface, the target material, the gas pressure, the cathode-anode distance, and so on.

Common target shapes are plane targets and rotating targets. Cylindrical plane sputtering targets. It is a new type of sputtering target with a very broad application market.

Common sputtering targets on the market mainly include plane targets and rotating targets, each of which has its own advantages and disadvantages.For planar targets, the main advantages are simple structure, strong versatility, and good film uniformity and repeatability.

The full name of ITO is indium tin oxide, a composition of indium, tin, and oxygen with different proportions.

There are four main forming methods for ITO target materials, and today I think it is necessary to talk about the advantages and disadvantages of each method, which will help you to choose between them when preparing ITO target materials

The four main forming methods of ITO target materials are: spraying method, cold isostatic pressing method, hot isostatic pressing method, and wet forming.

The maintenance methods of the sputtering target include the cleaning of the target, the sealing check, and the maintenance of the sputtering target

In the sputtering process of the coating of the target material, the quality of the target material is higher than that of the traditional material industry.

The titanium sputtering target is more like a titanium product. Using titanium as a raw material, titanium sputtering targets can be made by various methods.

Metal titanium and titanium sputtering targets are basically the same, and both are composed of titanium. Titanium targets are mainly used to coat surface panel displays of integrated circuits, flat panels and other components, or as decoration and glass coating.

The purity of the sputtering target material has a greater impact on the performance of the film to be coated.the higher the purity of the sputtering target, the better the performance of the deposited film.

The sputtering target bonding is the bonding of the sputtering target with the back target by solder. There are three main ways: crimping, brazing and conductive glue.

Tungsten targets are mainly prepared by powder metallurgy. The preparation method includes the steps of uniformly mixing tungsten powder with a purity of over 99.999% and a particle size of 3.2-4.2μm, placing it in a vacuum heat treatment furnace for pre-degassing, then introducing hydrogen, and continuing heating for degassing.