Crack formation usually occurs in ceramic sputtering targets (eg oxides, carbides, nitrides, etc.) and brittle material sputtering targets (eg chromium, antimony, bismuth, etc.).

PVD process is used for the deposition of coatings made of nitrides, carbides and carbonitrides of Ti, Cr, Zr and alloys like AlCr, AlTi, TiSi on a large range of tools and components. The typical process temperature for PVD coatings is between 250 and 450 °C. In some cases, PVD coatings can be deposited at temperatures below 70 °C or up to 600 °C,

Five important factors affecting the deposition rate of magnetron sputtering target coatings:working pressure,sputtering voltage,target base spacing,sputtering current and sputtering power.

As we all know, lanthanum boride is a thermionic material with the ability to emit electrons. Lanthanum boride sputtering targets have been used in the coating of electronic components.

One of the common methods of physical vapor deposition (PVD) is thermal evaporation. This is a form of thin film deposition. It is a vacuum technology used to apply evaporation coating materials to the surface of various objects.

Common target shapes are plane targets and rotating targets. Cylindrical plane sputtering targets. It is a new type of sputtering target with a very broad application market.

There are four main forming methods for ITO target materials, and today I think it is necessary to talk about the advantages and disadvantages of each method, which will help you to choose between them when preparing ITO target materials

The maintenance methods of the sputtering target include the cleaning of the target, the sealing check, and the maintenance of the sputtering target

In the sputtering process of the coating of the target material, the quality of the target material is higher than that of the traditional material industry.

Metal titanium and titanium sputtering targets are basically the same, and both are composed of titanium. Titanium targets are mainly used to coat surface panel displays of integrated circuits, flat panels and other components, or as decoration and glass coating.

The purity of the sputtering target material has a greater impact on the performance of the film to be coated.the higher the purity of the sputtering target, the better the performance of the deposited film.

The sputtering target bonding is the bonding of the sputtering target with the back target by solder. There are three main ways: crimping, brazing and conductive glue.

Tungsten targets are mainly prepared by powder metallurgy. The preparation method includes the steps of uniformly mixing tungsten powder with a purity of over 99.999% and a particle size of 3.2-4.2μm, placing it in a vacuum heat treatment furnace for pre-degassing, then introducing hydrogen, and continuing heating for degassing.

Pulsed laser deposition technology is currently the most promising film forming technology, which is simple and has many advantages.

The effect of sputtering target's grain size on the sputtering，The smaller the grain size of the sputtering target, the larger the grain boundary area and the greater the impact on performance.