Five important factors affecting the deposition rate of magnetron sputtering target coatings:working pressure,sputtering voltage,target base spacing,sputtering current and sputtering power.
As we all know, lanthanum boride is a thermionic material with the ability to emit electrons. Lanthanum boride sputtering targets have been used in the coating of electronic components.
Common target shapes are plane targets and rotating targets. Cylindrical plane sputtering targets. It is a new type of sputtering target with a very broad application market.
There are four main forming methods for ITO target materials, and today I think it is necessary to talk about the advantages and disadvantages of each method, which will help you to choose between them when preparing ITO target materials
The maintenance methods of the sputtering target include the cleaning of the target, the sealing check, and the maintenance of the sputtering target
In the sputtering process of the coating of the target material, the quality of the target material is higher than that of the traditional material industry.
Metal titanium and titanium sputtering targets are basically the same, and both are composed of titanium. Titanium targets are mainly used to coat surface panel displays of integrated circuits, flat panels and other components, or as decoration and glass coating.
The purity of the sputtering target material has a greater impact on the performance of the film to be coated.the higher the purity of the sputtering target, the better the performance of the deposited film.
The sputtering target bonding is the bonding of the sputtering target with the back target by solder. There are three main ways: crimping, brazing and conductive glue.
Pulsed laser deposition technology is currently the most promising film forming technology, which is simple and has many advantages.
The effect of sputtering target's grain size on the sputtering，The smaller the grain size of the sputtering target, the larger the grain boundary area and the greater the impact on performance.
Magnetron sputtering target poisoning treatment method, the target with intermediate frequency source or RF source hit one or two hours, can be recovered; the target removed, with sandpaper polishing, can also be solved.
Determine the target material and gas type, and then adjust its various parameters to prepare a color film
Magnetron sputtering is a kind of physical vapor deposition. Magnetron sputtering increases the plasma density and sputtering rate by introducing a magnetic field on the cathode surface of the target... ...
Ultra-high purity metal sputtering targets are an important part of electronic materials. At present, high-purity sputtering target products are mainly used in the semiconductor industry, flat panel display industry and solar cell industry.