Xinkang New Material Co., Ltd. is an expert in custom-made sputtering targets. The company can provide a full range of sputtering targets, including various components from industrial grade to ultra-high purity. Some additional servers can also be provided, including bindings and backplanes. The company always insists on R&D and manufacturing technology to provide more value and better products.Sputtering target customization: Xinkang New Material Co., Ltd. specializes in custom manufacturing various sputtering targets. We have many raw material compound production lines, such as semiconductor production lines, chemical compound production lines, metallurgical production lines, powder grinding production lines, etc. We also have an experienced research team. They have developed many new and special sputtering targets, and have successfully placed many trial orders, and have obtained many customer satisfaction and long-term friendships.Sputtering coating application: Sputtering coating film is mainly used in glass and decorative film, automotive electronics, flat panel display, optical communication/optical field, optical data storage field, thin film solar cell, magnetic data storage field. . .Manufacturing method of sputtering target:Xinkang has many manufacturing methods, the available methods are as follows: vacuum induction melting (VIM), vacuum induction levitation melting furnace vacuum sintering, vacuum casting, vacuum arc melting, hot pressing (HP), hot isostatic pressing (HIP), Cold isostatic pressing (CIP), cold pressing and sintering, FZ, CZ, CVD... Now our plasma spraying technology is being researched and improved, and we will provide some samples.Backplane and bonding services: The backplane includes OFHC copper, aluminum, titanium, stainless steel or molybdenum. The size will be designed according to your drawings.Bonding ServiceMetallization on the back, up to 1600 x 1000mmMetal and non-metal bonding coverage> 98%Bond integrity ultrasonic c-scanThe shape and size of the sputtering target: disc, rectangle, step, plate, sheet, tube, foil, rod, taper, ring, S-type gun, customized.Disc target, column target, stepped wafer target (diameter <350mm, thickness> 1mm)Rectangular target, slice target, step rectangular target (length <1500mm, Witdh <300mm, thickness> 1mm)Tubular target/rotating sputtering target (outer diameter <300mm, thickness> 2mm)List of sputtering targets (according to application):Semiconductor related target/electrode and wire film layout: aluminum target, copper target, gold target, silver target, palladium target, platinum target, silicon silicon aluminum target, silicon aluminum silicon copper alloy target, etc. .Coated electrode film: molybdenum target, tungsten target, titanium target, etc.;Agglutinated film: tungsten target, titanium target, etc.Insulating film: PbTiZrO3 target, etc.Hard disk with magnetic thin film magnetic recording: CoCrTa alloy target, CoCrPt alloy target, CoCrTaPt alloy target...Thin film magnetic head: CoTaCr alloy target, CoCrZr alloy target...Natural crystal film: CoPt alloy target, CoPd alloy target...Phase change optical disc recording film: TeSe target, SbSe target, GeSbTe target, GeTe alloy target...Magnetic disk magneto-optical recording film: TbDyCo alloy target, TbDyFe target, Al2Oe target, MgO target, SiN target...CD reflective film: aluminum target, AlTi alloy target, AlCr target, gold target, gold alloy target...CD protective film: SiN target, SiO2 target, ZnS target...Transparent conductive film for flat panel display: ITO target, AZO target, silica target, titanium target, chromium target...Display wiring film electrode: molybdenum target, tungsten target, titanium target, tantalum target, chromium target, aluminum target, aluminum titanium alloy target, AlTa alloy target, aluminum neodymium alloy target, AlNd alloy target material...Show thin film electroluminescence: ZnS doped Mn target, ZnS doped Tb target, ZnS doped Eu target, Y2O3 target, Ta2O5 target, BaTiO3 target...Decorative film: titanium target, zirconium target, chromium target, TiAl target, SS target...Low resistance film: NiCr target, NiCrSi alloy target, NiCrAl target, NiCu alloy target...Superconducting film: YBCO target (YBaCuO target), BiSrCaCuO target...Tool coating: Nitride target, carbide target, boride target, Cr target, Ti target, TiAl alloy target, Zr target, graphite target, aluminum 99.99%, chromium 99.5%, nickel/chromium 99.5%, nickel and alloy 99.5% , Tungsten carbide C: 0.4%, titanium and alloys (TiAL, TiALY) 99.5%, zirconium 99.5%Thin film solar cell: silicon sputtering target, gallium arsenide (GaAs) 99.999%, ITO 99.99%, titanium 99.9%, aluminum zinc oxide (AZO) 99.99%, zinc oxide (ZnO) 99.99% silicon dioxide (SiO2) 99.99%, titanium oxide (TiO2) 99.99%, molybdenum 99.9%, nickel/chromium (80:20) 99.5%, NiV target, chromium target 99.5~99.9%, cadmium telluride (CdTe) 99.999%, cadmium sulfide (CdS) ) 99.99%, 99.999%, platinum (Pt) 99.99%, GaSe target, GaS target, CuGa target, CuIn target, CuInGaSe (CIGS) 99.99%, CuInSe (CIS) 99.99%, ZnAl alloy sputtering target, CIG sputtering target (5N)List of sputtering target materials:Metal sputtering targets: aluminum (Al), antimony (Sb), bismuth (Bi), boron (B), cadmium (Cd), cerium (Ce), chromium (Cr), cobalt (Co), copper (Cu) , S (Dy), (Er), Euro (Eu), Ga (Gd), germanium (Ge), gold (Au), graphite, carbon (C), Ha (Hf), Hol (Ho), iridium (Ir) ), indium (In), iron (Fe), lanthanum (La), lead (Pb), L (Lu), manganese (Mn), molybdenum (Mo), magnesium (Mg), neodymium (Nd), niobium (Nb) ), nickel (Ni), palladium (Pd), platinum (Pt), Pra (Pr), hen (Re), ruthenium (Ru), Sa (Sm), Scan (Sc), selenium (Se), silicon (Si) ), silver (Ag), tantalum (Ta), b (Tb), tellurium (Te), tin (Sn), Th (Tm), titanium (Ti), tungsten (W), vanadium (V), Y (Yb) ), yttrium (Y), zirconium (Zr), zinc (Zn);Alloy sputtering targets: AlCu, AlCr, AlMg, AlNd, AlSi, AlSiCu, AlAg, AlV, CaNiCrFe, CaNiCrFeMoMn, CeGd, CeSm, CrSi, CoCr, CoCrMo, CoFe, CoFeB, CoNi, CoNiCr, CoPt, CoNbZr, CoTaZr, CoZr, CrV, Cr CrSi, CrCu, CuCo, CuGa, CuIn, CuNi, CoNiPt, CuZr, DyFe, DyFeCo, FeB, FeC, FeMn, GdFe, GdFeCo, HfFe, IrMn, IrRe, InSn, MoNb, MoSi, NiAl, NiCr , NiCrSi, NdDyFeCo, NiFe, NiMn, NiNbTi, NiTi, NiV, SmCo, AgCu, AgSn, TaAl, TbDyFe, TbFe, TbFeCo, TbGdFeCo, TiAl, TiNi, TiCr, WRe, WTi, WCu, ZrAl, ZrCu, ZrFe, , ZrNi, ZrTi, ZrY, ZnAl, ZnMg, and other customized alloy targets;Ceramic sputtering target:Boride ceramic sputtering targets: Cr2B, CrB, CrB2, Cr5B3, FeB, HfB2, LaB6, Mo2B, Mo2B5, NbB, NbB2, TaB, TaB2, TiB2, W2B, WB, VB, VB2, ZrB2, other doped bo ceramic targetCarbide ceramic sputtering targets: B4C, Cr3C2, HfC, Mo2C, NbC, SiC, TaC, TiC, WC, W2C, VC, ZrC, other doped carbide ceramic targetsFluoride ceramic sputtering targets: AlF3, BaF3, CdF2, CaF2, CeF3, DyF3, ErF3, HfF4, KF, LaF3, PbF2, LiF, PrF3, MgF2, NdF3, ReF3, SmF3, NaF, cryolite, SNa3AlF6 , ThF4, YF3, YbF3, other doped fluoride ceramic targetsNitride ceramic sputtering targets: AlN, BN, GaN, Hf NbN, Si3N4, TaN, TiN, VN, ZrN, other doped nitride ceramic targets;Oxide ceramic sputtering targets: Al2O3, Sb2O3, ATO, BaTiO3, Bi2O3, CeO2, CuO, Cr2O3, Dy2O3, Er2O3, Eu2O3, Gd2O3, Ga2O3, GeO2, HfO2, Ho2O3, In2O3, ITO, Feb, Fe2O3 Fe3Ob, La3O4, Lu2O3, MgO, MoO3, Nd2O3, Pr6O11, Pr(TiO2)2, Pr2O3, Sm2O3, Sc2O3, SiO2, SiO, SrTiO3, SrZrO3, Ta2O5, Tb2O2, TiTm, TiO2, ThO2, TiTm, ThO2 TiO2, SnO, WO3, V2O5, YAG, Y3Al5O12, Yb2O3, Y2O3, ZnO, ZnO: Al, ZrO2 (unstable), ZrO2-5-15wt% CaO) and other multi-element oxide targets;Selenide ceramic sputtering targets: Bi2Se3, CdSe, CuSe, Ga2Se3, In2Se3, PbSe, MoSe2, NbSe2, TaSe2, WSe2, ZnSe, and other doped brown aluminum targets;Silicide ceramic sputtering targets: Cr3Si, CrSi2, CoSi2, HfSi2, MoSi2, NbSi2, TaSi2, Ta5Si3, TiSi2, Ti5Si3, WSi2, V3Si, VSi2, ZrSi2, other doped silicide ceramic targets;Sulfide ceramic sputtering targets: AgS, Ag2S, CuS, Cu2S, Sb2S3, As2S3, CdS, FeS, GaS, GeS, PbS, SnS, In2S3, MoS2, NbS1.75, TaS2, WS2, ZnS, other doped sulfide ceramic target;Telluride ceramic sputtering targets: Al2Te3, Bi2Te3, CdTe, CuTe, Ga2Te3, GeTe, PbTe, MoTe2, NbTe2, TaTe2, TmTe, WTe2, ZnTe, and other doped telluride ceramic targets;Custom sputtering targets: AZO, Cr-SiO, CIGS, ITO, IGZO, GaAs, Ga-P, GaSb, In-Sb, InAs, InP, InSn, LSMO, Na3AlF6, YBCO, LCMO, YSZ, GeSbTe, etc. Custom sputtering Shooting targets;
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