Sputtering target is one of the core materials for semiconductor fabrication. In the semiconductor fabrication process, sputtering targets are Sputtering target is one of the core materials for manufacturing semiconductors. In the semiconductor manufacturing process, sputtering targets are used in both wafer manufacturing and chip packaging. In the wafer manufacturing process, sputtering targets are mainly used to make wafer conductive layers, barrier layers and metal gates. Usually, the purity of the target materials is required to be above 5N (99.999%), and copper targets, aluminum targets, and titanium are mainly used. Targets, tantalum targets, etc.; in the chip packaging process, sputtering targets are mainly used for the coating of chip bonding wires, and copper targets, aluminum targets, and titanium targets are mostly used.
Sputtered targets are used in wafer fabrication and chip packaging of semiconductors
Chip design (circuit design - design layout - mask fabrication) → wafer manufacturing (wafer bare wafer - metal splash plating (target coating) - coating photoresist - etching technology - photoresist removal - electroplating process) → chip packaging (wafer cutting - chip bonding wire (target coating) - plastic packaging process - electroplating molding) → chip testing (finished product test - finished chip)
Global wafer manufacturing capacity is accelerating to transfer to China, and domestic semiconductor material demand is expected to release. According to semi's prediction, 62 new Fabs will be built in the world by 2020, of which 26 will be located in China, accounting for 42%. The principle of "proximity" is usually adopted for semiconductor raw materials of new production lines, which is expected to accelerate the growth of domestic target manufacturers. In addition, according to the forecast data of China Electronics Industry Association, with the popularization of 12 inch wafer plants, it is expected that the growth rate of domestic target market will exceed 15%.
As an important semiconductor fabrication material, sputtering target directly benefits from the growth of semiconductor industry. The market scale of semiconductor materials expands with the growth of semiconductor industry. From 2014 to 2018, the domestic semiconductor material market scale increased from 53.42 billion yuan to 79.395 billion yuan, while the target cost accounted for a relatively fixed proportion in semiconductor materials, ranging from 2% - 3%. From 2014 to 2018, the domestic sputtering target market scale for semiconductor increased from 1.13 billion yuan to 1.948 billion yuan.
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