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sputtering target backing plate

High-purity metal sputtering targets are important sputtering coating raw materials in the manufacture of electronic products. Generally speaking, sputtering targets are mainly composed of target blanks, back plates and other parts. Among them, the target blanks are the target materials bombarded by high-speed ion beams, and belong to the core part of the sputtering targets. During the sputtering coating process, the target After the blank is hit by ions, the atoms on the surface are sputtered and deposited on the substrate to form an electronic film; because high-purity metals are generally soft, the sputtering target needs to be installed in a dedicated machine to complete the sputtering process. The inside of the machine is in a high-voltage and high-vacuum environment. Therefore, the backplane mainly serves to fix the sputtering target material and needs to have good electrical and thermal conductivity. During the magnetron sputtering coating process, the target needs to withstand the cooling water pressure on the back and the vacuum negative pressure on the front at the same time, so the target backplane is particularly important. Generally, aluminum alloy, copper and copper alloy backplanes are selected for target backplanes, mainly because the materials have high strength and good thermal conductivity, which can meet the needs of the semiconductor industry.


sputtering target backing plate


Welding method of target and back plate

Put the copper backing plate and the target into the cladding (in order to have a better bonding ability between the copper backing plate and the pre-bonded surface of the target, it is necessary to put the copper backing plate and the target into the cladding Treatment of the pre-bonded surface of the copper backing plate and target material, including: mechanical processing of the pre-bonding surface of the copper backing plate and target material to make the surface smoother, and then using organic solvents or acid solutions or a mixture of both The solution cleans the copper backing plate and the target material (above the removal of foreign matter on the surface), vacuums the sheath with the copper backing plate and the target material inside; seals the sheath so that external air cannot enter the sheath; The sheath provided with the copper back plate and the target material is hot isostatically welded to realize the welding of the copper back plate and the target material.



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