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Sputtering Target Bonding Service | Xk Supplier of Sputtering Target

Sputtering  Target Bonding


Bonding Service

The sputtering target bonding is the bonding of the sputtering target with the back target by solder. There are three main ways: crimping, brazing and conductive glue. Crimping adopts pressure strips. Generally, in order to improve the good contact, graphite paper, Pb or In will be added; in the case of soldering generally using solder, the solder is usually In, Sn, In-Sn, and the sputtering power is required to be less than 20W/cm2; The conductive adhesive used in the conductive adhesive must be resistant to high temperature, with a thickness of 0.02-0 05 microns. Oxygen-free copper backplane is the most common backplane for sputtering target bonding. It has sufficient strength, high thermal conductivity and high electrical conductivity. It is easy to construct. It is low in price and can be used repeatedly.

Benefits of bonding sputtering targets

· Prevent sputtering target materials from being unevenly broken by heating, such as brittle targets such as ITO, SiO2, ceramics and sintered targets;
· Save cost and prevent deformation. If the target material is too expensive, you can make the sputtering target thinner and glue the back plate to prevent deformation.

The choice of sputtering target backplane

·For the material requirements, oxygen-free copper and molybdenum targets are generally used, which has good electrical conductivity, and the thermal conductivity of oxygen-free copper is better than that of copper;
·The thickness is moderate. Generally, the thickness of the back target is about 3mm. Too thick, consume part of the magnetic strength; too thin, easy to deform.

Target bonding process

·Pre-treat the surface of the target and backplane before bonding,
· Fix the copper back plate on the heating table, place the target on the copper back plate, and heat the copper back plate.
·Heat to the binding temperature, and bond the target to the copper backplane by brazing
·Place a counterweight on the surface, and remove the counterweight after the target is cooled. In this way, the problem of uneven fluidity of indium is solved and the generation of pores on the bonding surface is avoided, thereby improving the bonding quality of the target material and the copper backing plate.


The above is a brief description of the bonding of sputtering targets. I hope everyone can understand the bonding of the targets. Xinkang New Material Company focuses on the development and production of sputtering targets. Founded by several doctors, masters and other scientific researchers from the School of Materials Science and Engineering, Central South University, it is a high-tech enterprise with independent intellectual property rights that integrates the research and development, production and sales of metal and ceramic compound coating materials. Welcome to leave a message ( sales@xk-sputteringtarget.com ) or call! ! !





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