The titanium sputtering target is made of titanium metal.As a metal, titanium is recognized for its high strength-to-weight ratio. It is a strong metal with low density that is quite ductile (especially in an oxygen-free environment), lustrous, and metallic-white in color. The relatively high melting point (more than 1,650 °C or 3,000 °F) makes it useful as a refractory metal. It is paramagnetic and has fairly low electrical and thermal conductivity.
Titanium sputtering targets and arc cathodes with Industrial grade are used for decorative coating to deposit golden, yellow, and golden yellow color. With up to 99.7% purity, uniform grain size, lower gas content, end user can obtain good hardness, high brightness, corrosion and oxidation resistant color without discolor and tarnish for a very long time. We have been supplying Titanium Sputtering Target or Titanium arc cathodes for manufacturers of watch, sanitary ware, car mirrors, etc, which are suitable for various magnetron sputtering machines and ionic plating machines.
High purity Titanium Sputtering Targets with up to 99.999% pure are usually used for integrated circuit, DRAMS and flat panel display application. When LSI, VLSI, and ULSI line networks are sputtered with high-purity titanium, these integrated components can be made light, thin, small in size, and dense in wiring. High purity titanium target can also be used as barrier metal material
The microstructure can be adjusted by our flexibility production process, to achieve your desired effect. If the grains of the sputtering target are uniformly aligned, the user can benefit from constant erosion rates and homogeneous layers. Following are two micrographs of our titanium sputtering target, the average grain size＜20μm.
The chemical purity is crucial to a metal sputtering target, if the purity is higher, the films will possess a more outstanding level of electrical conductivity and minimized particle formation during the PVD process. Following is a typically Certificate of analysis for 4N5 titanium sputtering target.
1. Metallic elements were analyzed by GDMS and ICP-OES.
2. Gas elements were analyzed by LECO.
Preparation process flow of titanium sputtering target
Material preparation-Electron beam melting-Chemical analysis-Forging-Rolling-Annealing-Metallographic inspection-Machining-Dimensional inspection-Cleaning-Final inspection-Packaging
Titanium sputtering target and preparation method thereof
The titanium target contains Au and Cu. The alloy composition in mass percentage is: 0.03%>Au>0.01%, 0.1%>Cu>0.07%, Fe<0.05%, 0<0.04%, N<0.015%, and the balance is Ti. Its manufacturing method is to mix AuCu20 alloy powder with a particle size of -300 mesh to -400 mesh with 1/2 inch small size sponge titanium titanium, and then use an electron bombardment furnace for electron beam cooling bed smelting and purification to make titanium Ingot, the titanium ingot is made into a titanium target of the required specification and size by a mechanical processing method. The thickness of the film made by the titanium target of the above method is uniform, and it has stronger wear resistance and strong adhesion than the conventional coating Features.
Other alloy forms of titanium sputtering target
Titanium aluminum, titanium chromium, titanium nickel alloy, etc.