Changsha Xinkng Advanced MaterialsCo.,Ltd Metal Sputtering Targets Aluminum Sputtering Target
Aluminum Sputtering Target
Aluminum Sputtering Target
Attributes Name
High purity metal sputtering target
Product Name
Aluminum Sputtering Target
Element Symbol
4N, 5N, 5N5
Planar target, Rotary target
Aluminum(Al)Sputtering Target Description

Aluminum sputtering target has the same function as metal aluminum.Aluminium is a chemical element with the symbol Al and atomic number 13. It is a silvery-white, soft, non-magnetic and ductile metal in the boron group. Aluminium is remarkable for its low density and its ability to resist corrosion through the phenomenon of passivation. Aluminium and its alloys are vital to the aerospace industry and important in transportation and building industries, such as building facades and window frames.3N8-4N8 pure aluminum is used for rolling electrolytic capacitor aluminum foil, lighting fixtures and data storage. 5N-6N ultra-pure aluminum is used in the manufacture of semiconductor devices, fabrication of optoelectronic storage media, superconducting cable stabilization materials, and space shuttle scientific research.

Following are two micrographs of our aluminum sputtering target, the average grain size<300μm.

Aluminum sputtering target  Al sputtering target

The sputtering targets we produced are high purity, it’s most important benefits are that your films possess an outstanding level of electrical conductivity and minimized particle formation during the PVD process. Below form is a typically Certificate of analysis for Our aluminum sputtering target is high purity, the most important benefit is that the films will possess an outstanding level of electrical conductivity and minimized particle formation during the PVD process. Following is a typically Certificate of analysis for 5N aluminum sputtering target.

Analytical Methods:
1. Metallic elements were analyzed by GDMS and ICP-OES.
2. Gas elements were analyzed by LECO.

Al sputtering target

Process flow for preparing aluminum sputtering target

Material preparation-zone smelting-chemical analysis-forging-rolling-annealing-metallographic inspection-machining-size inspection-cleaning-final inspection-packaging

Aluminum sputtering target and preparation method thereof
Aluminum is obtained by extracting Al2O3 from bauxite and electrolyzing it in molten cryolite. The purity is generally above 99%. However, aluminum with such a purity cannot be used as the raw material for the production of aluminum targets. The first and most important requirement is high purity. The high-purity aluminum used in the aluminum target is produced through segregation, three-layer electrolysis or combined zone smelting. The price is more expensive than industrial pure aluminum 99.7 Many, the highest purity in China is about 99.9999% (6N). With high-purity aluminum ingots as raw materials, forging, rolling, and heat treatment of the raw materials can make the grains in the aluminum ingots become smaller and increase the density to meet the requirements of aluminum targets for sputtering. The high-purity aluminum material after deformation is processed by mechanical processing. The aluminum target processing requires high precision and high surface quality, and it can be processed into the target size required by the vacuum coating machine.

Other alloy forms of aluminum sputtering target
Aluminum silicon, aluminum copper, aluminum magnesium, aluminum zinc and aluminum rare earth alloys.

Titanium Sputtering Target
Chromium Sputtering Target