Copper sputtering target has the same properties as metal copper（Cu）.Copper is a chemical element with the symbol Cu (from Latin: cuprum) and atomic number 29. It is a soft, malleable, and ductile metal with very high thermal and electrical conductivity. A freshly exposed pure copper is pinkish-orange. Copper is used as a conductor of heat and electricity, as a building material, and as a constituent of various metal alloys.Copper Sputtering Target is produced by melting technology, it’s widely applied for semiconductor, decorative coating and advanced packing field.
We can produce copper sputtering target with purity of 99.9%~99.9999%, and the lowest oxygen content can be <1ppm, it is mainly used for display screen and touch screen wiring and protective film, solar light absorbing layer, semiconductor wiring, etc. We not only produce planar copper sputtering targets (maximum G8.5 generation), but also copper rotary targets, which are mainly used for the touch screen industry. Since it is difficult to break the grain, we can only process with very large deformation and control the growth of twins to achieve a fine and uniform microstructure, which ensure a lower erosion rate and sensitivity of the formation of particles during sputtering.
Following are two micrographs of our copper sputtering target, the average grain size＜50μm
Our copper sputtering target is high purity, the most important benefit is that the films will possess an outstanding level of electrical conductivity and minimized particle formation during the PVD process. Following is a typically Certificate of analysis for 4N copper sputtering target.
1. Metallic elements were analyzed by GDMS and ICP-OES.
2. Gas elements were analyzed by LECO.
Preparation process of copper sputtering target
Material preparation-electrolytic purification & electron beam melting-chemical analysis-forging-rolling-annealing-metallographic inspection-machining-dimensional inspection-cleaning-final inspection-packaging
Copper sputtering target and preparation method thereof
The copper is purified from 99.95% to 99.99%, 99.999%, and 99.9999% through multiple electrolysis and regional smelting. The highest purity in China is about 99.9999% (6N). With high-purity copper ingots as raw materials, forging, rolling, and heat treatment of the raw materials can make the crystal grains in the copper ingots become smaller and increase the density to meet the requirements of copper targets for sputtering. The high-purity copper material after the deformation treatment is mechanically processed. The copper target processing requires high precision and high surface quality, and it can be processed into the target size required by the vacuum coating machine.
Other alloy forms of copper sputtering target
Tin-copper, arsenic-copper, tungsten-copper, silver-copper, copper-phosphorus, nickel-copper alloy targets, etc.