The nickel sputtering target is composed of high-purity nickel metal.Nickel is a silvery-white metal with a slight golden tinge that takes a high polish. It is one of only four elements that are magnetic at or near room temperature, the others being iron, cobalt and gadolinium. Its Curie temperature is 355 °C (671 °F), meaning that bulk nickel is non-magnetic above this temperature. The unit cell of nickel is a face-centered cube with the lattice parameter of 0.352 nm, giving an atomic radius of 0.124 nm. This crystal structure is stable to pressures of at least 70 GPa. Nickel belongs to the transition metals. It is hard, malleable and ductile, and has a relatively high for transition metals electrical and thermal conductivity. The high compressive strength of 34 GPa, predicted for ideal crystals, is never obtained in the real bulk material due to the formation and movement of dislocations; however, it has been reached in Ni nanoparticles.
The highest purity of Nickel sputtering target is 99.999%, it is normally used in the semiconductor and microelectronics industries, Nickel sputtering target is the key material for semiconductor back electrodes. After repeated plastic processing, our nickel target has high density, high purity and uniform grain size. The pictures below are two micrographs of our nickel sputtering target, the average grain size＜100μm.
The sputtering targets we produced are high purity, it’s most important benefits are that your films possess an outstanding level of electrical conductivity and minimized particle formation during the PVD process. Below form is a typically Certificate of analysis for 4N high purity Nickel sputtering target.
1. Metallic elements were analyzed by GDMS and ICP-OES.
2. Gas elements were analyzed by LECO.
Process flow for preparing nickel sputtering target
Material preparation-vacuum induction melting & electron beam melting-chemical analysis-forging-rolling-annealing-metallographic inspection-machining-dimensional inspection-cleaning-final inspection-packaging
Nickel sputtering target and preparation method thereof
Provide nickel ingots; hot forging of nickel ingots to form a first nickel target blank; first heat treatment of the first nickel target blank to form a second nickel target blank, the first heat treatment temperature is 450℃～550℃, heat preservation 1 Hours to 2 hours; after the first heat treatment, the second nickel target blank is hot rolled to form a third nickel target blank; the third nickel target blank is subjected to a second heat treatment to form a fourth nickel target blank. The heat treatment temperature is 300℃～500℃, and the heat preservation time is 1 hour to 2 hours; after the second heat treatment, the fourth nickel target blank is cold rolled to form the fifth nickel target blank; the fifth nickel target blank is subjected to the third Heat treatment to form a nickel target. The third heat treatment temperature is 200℃～300℃, and the temperature is kept for 1 hour to 2 hours. The internal structure of the nickel target manufactured by this technical solution is relatively uniform and has good magnetic properties.
Other alloy forms of nickel sputtering target
Nickel-chromium, nickel-iron, nickel-copper, nickel-vanadium alloy targets, etc.