Changsha Xinkng Advanced MaterialsCo.,Ltd Alloy Sputtering Target Nickel platinum sputtering target
Nickel platinum sputtering target
Nickel platinum sputtering target
Attributes Name
Nickel Alloy Sputtering Targets
Product Name
Nickel platinum sputtering target
Element Symbol
Ni + Pt
Purity
3N、3N5
Shape
Disc, customized
Nickel platinum( NiPt)alloy Sputtering Target Description


The nickel platinum alloy sputtering target is a silver-gray metal target which melting point is 1400-1650°C; density is 18.63 g/cm3; and resistivity is 29.8 µΩ•cm (20°C).

Preparation method of nickel platinum alloy sputtering target
Nickel and platinum are used as raw materials, they are melted to be high purity nickel platinum alloy ingot by vacuum electron beam; the high purity nickel platinum alloy ingot is subjected to radial hot forging and annealing; the high purity nickel platinum alloy ingot is longitudinally processed Pier roughing and annealing treatment; hot rolling, cold rolling and recrystallization annealing treatment of high purity nickel platinum alloy ingots to form nickel platinum alloy target blanks; mechanical processing of nickel platinum alloy target blanks to form nickel platinum alloy target materials. Through high temperature smelting, vacuum electron beam smelting, radial hot forging and annealing treatment, longitudinal pier roughing and annealing treatment, hot rolling and cold rolling and recrystallization annealing treatment, etc., uniform composition, high purity, fine grains, and oxygen content are obtained. Such a target material is beneficial to obtain a high quality film with uniform thickness and few particles.

Application field of nickel platinum alloy sputtering target
Nickel platinum alloy sputtering targets are widely used in the semiconductor industry. Through magnetron sputtering, a nickel platinum alloy target is deposited on the surface of a silicon device and reacts to form a thin film of nickel platinum silicide to realize semiconductor contact and interconnection.







Nickel aluminum sputtering target