Copper (Cu) Sputtering Target
  • Attributes Name
    Metal sputtering target
  • Product Name
    Copper Sputtering target
  • Element Symbol
  • Purity
  • Shape
Request a Quote
Or Cal +86-731-84027969
Copper sputtering target has the same properties as metal copper(Cu).Copper is a chemical element with the symbol Cu (from Latin: cuprum) and atomic number 29. It is a soft, malleable, and ductile metal with very high thermal and electrical conductivity. A freshly exposed pure copper is pinkish-orange. Copper is used as a conductor of heat and electricity, as a building material, and as a constituent of various metal alloys.Copper Sputtering Target is produced by melting technology, it’s widely applied for semiconductor, decorative coating and advanced packing field.

We can produce copper sputtering target with purity of 99.9%~99.9999%, and the lowest oxygen content can be semiconductor wiring, etc. We not only produce planar copper sputtering targets (maximum G8.5 generation), but also copper rotary targets, which are mainly used for the touch screen industry. Since it is difficult to break the grain, we can only process with very large deformation and control the growth of twins to achieve a fine and uniform microstructure, which ensure a lower erosion rate and sensitivity of the formation of particles during sputtering.

Following are two micrographs of our copper sputtering target, the average grain size<50μm

Chemical Specification:

Our copper sputtering target is high purity, the most important benefit is that the films will possess an outstanding level of electrical conductivity and minimized particle formation during the PVD process. Following is a typically Certificate of analysis for 5N copper sputtering target. 


Copper sputtering target preparation process

Material preparation-electrolytic purification & electron beam melting-chemical analysis-forging-rolling-annealing-metallographic inspection-machining-dimensional inspection-cleaning-final inspection-packaging

Copper sputtering target and preparation method there of

The copper is purified from 99.95% to 99.99%, 99.999%, and 99.9999% through multiple electrolysis and regional smelting. The highest purity in China is about 99.9999% (6N). With high-purity copper ingots as raw materials, forging, rolling, and heat treatment of the raw materials can make the crystal grains in the copper ingots become smaller and increase the density to meet the requirements of copper targets for sputtering. The high-purity copper material after the deformation treatment is mechanically processed. The copper target processing requires high precision and high surface quality, and it can be processed into the target size required by the vacuum coating machine.

Related Sputtering Materials

CuNi sputtering target

AlCu sputtering target

Cu2ZnSnS4 sputtering target

CuNiTi sputtering target

CuS sputtering target

CuSn sputtering target

CuZn sputtering target

CoCu sputtering target

Cu2O sputtering target

CoCrZr sputtering target

CoNiMn sputtering target

CuO sputtering target

AlSiCu sputtering target
Leave a Comment
Your email address will not be published. Required fields are marked *
Your Name*
Your Email*
Submit Comment
You May Also Looking For…
Metal Sputtering Targets | Xinkang Materials
Talk to Our Expert About Your Needs !
Request a Quote
Metal Sputtering Targets | Xinkang Materials
Enter your inquiry details, We will reply you in 24 hours
Submit Request